Signal & Power Integrity

Signal, Power, and Board Thermal Integrity Training

Course is designed to provide a comprehensive understanding of signal, power, and board thermal integrity to both freshers and working professionals. The course will cover the basics of signal and power integrity, as well as board thermal management techniques. The course will also cover advanced topics such as electromagnetic interference (EMI) and electromagnetic compatibility (EMC).

Module 1: Introduction to Signal and Power Integrity

• Overview of signal and power integrity concepts and Basics of Electromagnetic as applicable to signal/power integrity

• Signal integrity topology analysis, Impedance matching(Z0 : single-ended & differential) and termination techniques

• Transmission lines & their effects, reflections & impedance mismatch analysis

• Types of model for analysis(IBIS, IBIS AMI, S-parameter and Spice)

• Stack-up design, via design & quality routing concepts, S-parameter & TDR

• Crosstalk (NEXT: near-end/FEXT: far-end)

• Power distribution network design and analysis

• Decoupling cap selection and analysis

Module 2: Advanced Signal and Power Integrity Techniques

• Crosstalk and noise analysis

• High-speed design techniques for good signal and power integrity

• Advanced power distribution network design and analysis

• Hands-on simulation experience on High speed serial/parallel interface analysis and design guidelines (DDR3, DDR4, SERDE, PCIe gen4, XAUI, HDMI,          SATA, USB, chip-to-chip/FPGA IO)

• Pre-layout & Post-layout SI/PI analysis.

• IBIS/IBIS-AMI based system level SI evaluation.

• Trace (microstrip & stripline,) & Via design for controlled impedance using EM solver.

• Crosstalk and s-parameter modeling of traces and interconnects on package and board.

Module 3: Board Thermal Management

• Overview of board thermal management

• Thermal simulation and analysis techniques

• Thermal management techniques such as heatsinks and fans

Module 4: EMI and EMC Design Considerations

• Overview of EMI and EMC concepts

• EMI and EMC analysis and mitigation techniques

• PCB design guidelines for EMI and EMC

Module 5: Board-level Testing and Validation

• Overview of board-level testing and validation

• Board-level testing techniques and procedures

• Validation of signal, power, and thermal integrity of a PCB design

Delivery Method: The course will be delivered through a combination of lectures, practical exercises, and hands-on projects. Students will be provided with relevant study materials and will be expected to complete assignments and projects as part of their training. The course can be conducted in-person or online, depending on the convenience of the students.

Duration: The course will have a total duration of 40 hours, which can be spread over a period of 4 weeks. The class will be held for 3 hours per day, 5 days a week.

Prerequisites:

• A basic understanding of electronics and digital circuit design concepts.

• Familiarity with schematic capture and PCB design software tools is preferred, but not mandatory

Certification: Upon successful completion of the course and passing the exam, students will receive a certificate of completion.